october 2006 p2560b rev 1.3 notice: the information in this document is subject to change without notice. pulsecore semiconductor corporation 1715 s. bascom ave suite 200, campbell, ca 95008 ? tel: 408-879-9077 ? fax: 408-879-9018 www. p ulsecoresemi.com low frequency emi reduction features ? fcc approved method of emi attenuation ? generates a low emi spread spectrum and a non spread reference signal of the input clock frequency ? optimized for input frequency range from 20 to 32mhz ? internal loop filter minimizes external components and board space ? two selectable spread ranges ? 3.3v operating voltage ? ultra low power cmos design: 5.50 ma @3.3v ? supports notebook vga and other lcd timing controller applications ? available in 8-pin soic and tssop product description the p2560b is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. it reduces electrom agnetic interference (emi) at the clock source allowing syst em-wide reduction of emi of downstream clock and data dependent signals. it allows significant system cost saving s by reducing the number of circuit board layers and shielding traditionally required to pass emi regulations. the p2560b modulates the output of a single pll in order to spread the bandwidth of a synthesized clock, thereby decreasing the peak amplitudes of its harmonics. this results in significantly lower system emi compared to the typical narrow band signal produced by oscillators and most clock generators. lowering emi by increasing a signal?s bandwidth is called spread spectrum clock generation. the p2560b uses the most efficient and optimized modulation profile approved by the fcc and is implemented by using a proprietary all-digital method. applications the p2560b is targeted toward the notebook vga chip and other displays using an lvds interface, pc peripheral devices and embedded systems. block diagram vdd vss modout xin /clkin frequency divider feedback divider modulation phase detector loop filte r vco output divide r pll crystal oscillator xout
october 2006 p2560b rev 1.3 low frequency emi reduction 2 of 8 notice: the information in this document is subject to change without notice. pin configuration pin description pin# pin name type description 1 xin / clkin i crystal connection or external frequency input. this pin has dual functions. it can be connected to either an external crystal or an external reference clock 2 vdd p power supply for the entire chip. 3 vss p ground to entire chip. 4 modout o spread spectrum low emi output. 5 nc - no connect 6 nc - no connect 7 nc - no connect 8 xout o crystal connection. if using an external reference, this pin must be left unconnected. spread range selection, vdd = 3.3 v clkin frequency spreading range modulation rate 20 mhz 1.16% 25 mhz 1.13% 27 mhz 1.11% 30 mhz 1.10% 32 mhz 1.10% (clkin/10) * 20.83 khz nc nc 1 2 3 4 5 6 7 8 p2560b xin / clkin vdd vss modout nc xout
october 2006 p2560b rev 1.3 low frequency emi reduction 3 of 8 notice: the information in this document is subject to change without notice. schematic for notebook vga application absolute maximum ratings symbol parameter rating unit v dd , v in voltage on any pin with respect to ground -0.5 to +4.6 v t stg storage temperature -65 to +125 c t a operating temperature -40 to +85 c t s max. soldering temperature (10 sec) 260 c t j junction temperature 150 c t dv static discharge voltage (as per jedec std 22- a114-b) 2 kv note: these are stress ratings only and are not implied for functional use. exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. p2560b clkin/xin vdd nc nc vss modout nc 1 2 3 4 5 6 7 8 xout 27 mhz vdd fb 0.1uf fb : optional ferrite bead gnd 27pf 27pf
october 2006 p2560b rev 1.3 low frequency emi reduction 4 of 8 notice: the information in this document is subject to change without notice. dc electrical characteristics symbol parameter min typ max unit v il input low voltage vss ? 0.3 - 0.8 v v ih input high voltage 2.0 - vdd + 0.3 v i il input low current -60.0 - -35 a i ih input high current - - 35 a i xol xout output low current v xol at 0.4v, v dd = 3.3v - 3 - ma i xoh xout output high current v xoh at 2.5v, v dd = 3.3v - 3 - ma v ol output low voltage v dd = 3.3v, i oh = 20ma - - 0.4 v v oh output high voltage v dd = 3.3v, i oh = 20ma 2.5 - - v i dd static supply current clki n / xin pulled low - 0.6 - ma i cc dynamic supply current 3.3v and 10pf loading 3.2 - 7.0 ma v dd operating volt age 3.0 3.3 3.6 v t on power up time (first locked clo ck cycle after power up) - 0.18 - ms z out clock output impedance - 50 - ? ac electrical characteristics symbol parameter min typ max unit f in input frequency 20 - 32 mhz f out output frequency 20 - 32 mhz t lh 1 output rise time measured from 0.8v to 2.0v 0.7 0.9 1.1 ns t hl 1 output fall time measured from 2.0v to 0.8v 0.6 0.8 1.0 ns t jc jitter (cycle to cycle) - - 360 ps t d output duty cycle 45 50 55 % note: 1. t lh and t hl are measured into a capacitive load of 15pf
october 2006 p2560b rev 1.3 low frequency emi reduction 5 of 8 notice: the information in this document is subject to change without notice. package information 8-lead (150-mil) soic package d e h d a1 a2 a l c b e dimensions inches millimeters symbol min max min max a1 0.004 0.010 0.10 0.25 a 0.053 0.069 1.35 1.75 a2 0.049 0.059 1.25 1.50 b 0.012 0.020 0.31 0.51 c 0.007 0.010 0.18 0.25 d 0.193 bsc 4.90 bsc e 0.154 bsc 3.91 bsc e 0.050 bsc 1.27 bsc h 0.236 bsc 6.00 bsc l 0.016 0.050 0.41 1.27 0 8 0 8 note: controlling dimensions are millimeters soic ? 0.074 grams unit weight
october 2006 p2560b rev 1.3 low frequency emi reduction 6 of 8 notice: the information in this document is subject to change without notice. e h a a1 a2 d b c l e 8-lead thin shrunk small outline package (4.40-mm body) dimensions inches millimeters symbol min max min max a 0.043 1.10 a1 0.002 0.006 0.05 0.15 a2 0.033 0.037 0.85 0.95 b 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 d 0.114 0.122 2.90 3.10 e 0.169 0.177 4.30 4.50 e 0.026 bsc 0.65 bsc h 0.252 bsc 6.40 bsc l 0.020 0.028 0.50 0.70 0 8 0 8 note: controlling dimensions are millimeters tssop ? 0.0325 grams unit weight
october 2006 p2560b rev 1.3 low frequency emi reduction 7 of 8 notice: the information in this document is subject to change without notice. ordering information part number marking package configuration temperature range p2560bg-08st p2560bg 8-pin soic, tube, green commercial p2560bg-08sr p2560bg 8-pin soic, tape and reel, green commercial i2560bg-08st i2560bg 8-pin soic, tube, green industrial I2560BG-08SR i2560bg 8-pin soic, tape and reel, green industrial p2560bg-08tt p2560bg 8-pin tssop, tube, green commercial p2560bg-08tr p2560bg 8-pin tssop, tape and reel, green commercial i2560bg-08st i2560bg 8-pin t ssop, tube, green industrial I2560BG-08SR i2560bg 8-pin tssop, tape and reel, green industrial device ordering information p2560b g-08xx sr - soic, t/r tt ? tssop, tube tr - tssop, t/r st ? soic , tube device number flow: p = commercial temperature range (0c to 70c) i = industrial temperature range (-40c to 85c) pin count deviation (%) a nd spread option identifier g = green package, lead free, and rohs licensed under us patent #5,488 ,627, #6,646,463 and #5,631,920.
october 2006 p2560b rev 1.3 low frequency emi reduction 8 of 8 notice: the information in this document is subject to change without notice. ? copyright 2006 pulsecore semiconductor corporation. all rights reserved. our logo and name are trademarks or registered trademarks of pulsecore semiconductor. all ot her brand and product names may be the trademarks of their respective companies. pulsecore reserves the right to make changes to this document and its products at any time without notice. pulsecore assumes no responsibility for any errors t hat may appear in this document. the data contained herein represents pulsecore?s best data and/or estimates at the time of issuance. pulsecore reserves the right to change or correct this data at any time, without notice. if the product descri bed herein is under development, significant changes to these specifications are possible. the information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. pulsecore does not assume any responsibility or liability arising out of the app lication or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of pulsecore products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in pulsecore? s terms and conditions of sale (which are available from pulsecore). all sales of pulsecore products are made exclusiv ely according to pulsecore?s terms and conditions of sale. the purchase of products from pulsecore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellect ual property rights of pulsecore or third partie s. pulsecore does not authorize its products for use as critical components in life-supp orting systems where a malfunction or failu re may reasonably be expected to result in significant injury to the user, and the inclusion of pulsec ore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to inde mnify pulsecore against all claims arising from such use. pulsecore semiconductor corporation 1715 s. bascom ave suite 200 campbell, ca 95008 tel: 408-879-9077 fax: 408-879-9018 www.pulsecoresemi.com copyright ? pulsecore semiconductor all rights reserved preliminary information part number: p2560b document version: v1.3 note: this product utilizes us patent # 6,646,463 impedance emulator patent issued to pulsecore semiconductor, dated 11-11-2003
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